Making it cool: thermal management challenges in military electronics systems
Ondemand Air Live:December 04, 2012
Designers of electronic systems for unmanned vehicles, radar systems, fighter aircraft, ground vehicles, helicopter avionics, etc., all share a common challenge -- how to keep electronic systems cool when modern processors and boards generate so excessive heat and power. Today's chips from Intel, Freescale, and others provide unprecedented performance that military systems cannot leave out when engineering military systems. Yet their excessive heat coupled with increased requests from Department of Defense program managers for rugged small form factor designs and packaging at lower costs forces military embedded designers to be innovative and inventive with thermal management. This webcast of industry experts will discuss these Size, Weight, and Power (SWaP) challenges and more.
Sponsors: Mercury, Pentek, GE Intelligent Platforms
Moderator: John McHale, Open Systems Media
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