Military Embedded Systems

Curtiss-Wright

Articles 1 - 5
Radar/EW

SOSA Technical Standard will benefit systems of all kinds - Story

February 05, 2021

The standards currently being defined by the Sensor Open Systems Architecture (SOSA) Consortium will deliver many clear benefits to system integrators designing embedded sensor-processing systems. The SOSA Technical Standard will define common pinouts that foster and ease interoperability. Greater system flexibility will come from the ability to place a variety of module types into the same system slot, while convergence on common interconnect technologies (such as backplane Ethernet) will ease the integration of modular systems.

Radar/EW

VME lives! - Story

February 09, 2018
As we start a new year, it is customary to look ahead at emerging technologies, both evolutionary and revolutionary. But as the calendar changes, it is also a time to reflect on the past and where we are today. Although recent years have produced few entirely new platforms designed from the ground up, our industry continues to deliver higher levels of performance and new capabilities within existing systems.
Comms

Ethernet for synchronization: It's about time - Story

October 17, 2017
Today's embedded systems often include several counters and clocks that keep track of time, and ensuring that they are accurate - and synchronized across multiple devices - can be critical. For example, synchronized clocks can be used to partition shared resources (such as network links) in distributed systems with critical real-time requirements.
Radar/EW

10 Gigabit backplane Ethernet for embedded supercomputers - Story

June 14, 2016
Designers of next-generation high-performance embedded computing (HPEC) solutions for demanding intelligence, surveillance, and reconnaissance (ISR) systems applications got a boost from the introduction of Intel's multicore Xeon D system-on-chip (SoC) processor earlier in 2016. This device provides as many as 16 cores in the same power footprint as earlier four-core devices and features the rugged ball-grid-array (BGA) packages and extended temperature range needed for deployed applications.
Articles 1 - 5