Radar/EW - Thermal Management

Thermal-management innovations sought by DARPA, HRL Laboratories

March 13, 2025

MALIBU, Calif. Technology research concern HRL Laboratories will present a superior cooling system for stacks of microelectronic chips as part of a project launched by the Defense Advanced Research Project Agency (DARPA) that seeks to create compact thermal-management technology in a chip stack using 3D heterogeneous integration (3DHI).

Radar/EW - Thermal Management

Thermal-management innovations sought by DARPA, HRL Laboratories

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