ADI expands its IMU portfolio with the ADIS1657x IMU Family. This small but powerful product offers the stability and vibration rejection of the previous tactical grade line, in a rugged 22.4x24.5x14mm package.

The ADAR3006 and ADAR3007 are multi-beam, low power Satcom beamformers that enable both terrestrial gateways and satellite payloads. The unique 4 beam/4 channel architecture can easily scale depending on the number of beams required as well as number of elements.

Eindhoven, Germany and Phoenix, AZ USA – 14 November 2024 Emproof, an innovator in embedded system security, and DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, have announced a strategic partnership. Together, the companies are introducing advanced security solutions for Deos™-based systems, detailed in their newly released whitepaper; Advanced Embedded Security with DDC-I Deos and Emproof Nyx.

ADL8103 – 1.7dB NF and 6W (36dBm) Max Input Power

SAINT-PREX, Switzerland. Data protocols are constantly evolving to enable interoperability and reliable transfer of increasing amounts of data at the highest speeds between more and more connected devices. To address this technological challenge, Fischer Connectors is expanding its platform capabilities to meet the most demanding connectivity requirements for high-speed data transfer using the USB 3.2 Gen 2 protocol up to 10 Gbit/s.

SAN ANTONIO, Texas, Sept. 10, 2024 – Darkhive, Inc., a defense tech startup focused on open architecture Uncrewed Aircraft Systems (UAS) integrated with a secure software delivery system, closed its Series A investment round led by Ten Eleven Ventures.

VersaLogic Corp., the embedded industry’s most trusted computer company, has released a new family of rugged embedded computers featuring a high-performance Intel® Xeon® processor.

RESTON, Va., Sept. 3, 2024 /PRNewswire/ -- Metron Inc., in partnership with Cellula Robotics USA, Inc. a wholly owned subsidiary of Cellula Robotics Ltd. announced today the successful completion of a series of Uncrewed Underwater Vehicle (UUV) demonstrations to showcase the capabilities of the new ANCC+Solus solution for defense and commercial applications.

NORWOOD, Mass. United Electronic Industries (UEI) announced the launch of the DNR-MIL-4 4-slot military-grade I/O system designed to meet the rigorous demands of the aerospace and defense industries.

Pixus Technologies, a provider of embedded computing and enclosure solutions, offers new 3U and 6U handle/panel sets for OpenVPX and other architecture boards.

Orlando, Florida, August 13th, 2024 – EIZO Rugged Solutions Inc., a provider of ruggedized graphics, displays, and video electronics hardware, released the Condor™ NVA2102xX – a rugged XMC form-factor video graphics card designed for high-performance embedded computing applications that require real-time video/sensor capture and AI-accelerated GPGPU processing.

Trevose, PA. AIM introduced its newest small-form-factor (SFF) embedded board for MIL-STD-1553 in a small 2260 M.2 form factor, with the small board aimed at enabling the use of COTS [commercial off-the-shelf] and MOTS [military off-the-shelf] technology in rugged embedded applications. 

Quad input, single output receive device.

GRENOBLE, France. Teledyne e2v announced that the company has qualified and released an upscreened version of the LX2160 high-reliability processor to operate between -55 °C to +125 °C.

GRENOBLE, France. Teledyne e2v announced the successful space qualification of its 8 GB space DDR4 memory targeting high-reliability space-based applications including communications, Earth observation, scientific, and edge compute satellite roles.