Military Embedded Systems

New Innovations Aligned With the SOSA™ Technical Standard from Pixus Technologies

Eletter Product

Pixus is a leader in OpenVPX backplane & chassis platforms for your SOSA/HOST/CMOSS or other application. Our modular products and vast array of designs greatly reduces lead-time, cost, and risk for your system requirement.

Development Chassis for 3U or 6U SOSA OpenVPX
Development Chassis for 3U or 6U SOSA OpenVPX

With off-the-shelf components, the Pixus open frame enclosures feature power and ground slots with VITA 67.3c interfaces for 3U or 6U boards.  The design includes SOSA clocking, and options for modules with grounded rows.  Supports air and/or conduction-cooled modules and speeds up to 100GbE.

Horizontal-mount OpenVPX for 3U/6U Hybrid Solutions
Horizontal-mount OpenVPX for 3U/6U Hybrid Solutions
The Pixus OpenVPX SlimBox series supports a mix of 3U and 6U OpenVPX boards.   The backplanes can be configuration for SOSA profiles and VITA 66/67 interfaces.   Includes both front-to-rear and side-to-side cooling options.

OpenVPX Chassis Manager for SOSA
OpenVPX Chassis Manager for SOSA
The Pixus OpenVPX Chassis Manager is Tier 2 compliant to the VITA 46.11 system management for OpenVPX specification.  With faceplate options in 3U or 6U and 1.0” wide or 0.8” wide, the chassis managers plug into any backplane slot via the P0 connector.  Includes options for additional I/O interfaces. A VITA 48.2 compliant conduction-cooled version is also available.

MIL-grade Rackmount with Air-Flow-Through Design and New ATR for 6U OpenVPX
MIL-grade Rackmount with Air-Flow-Through Design and New ATR for 6U OpenVPX

For the advanced cooling requirements of today’s SOSA / OpenVPX systems, Pixus offers an air-flow-through module design. This design can be incorporated in 19” rackmount MIL chassis for 3U or 6U boards. Pixus has also developed new ATR enclosures for 6U OpenVPX in both depths for 160mm and 220mm boards.

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Pixus Technologies

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