Military Embedded Systems

Commercial sensors and AI to be used by DARPA under new partnership

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January 05, 2021

Emma Helfrich

Technology Editor

Military Embedded Systems

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ROCKVILLE, Md. CEVA, Inc., licensor of wireless connectivity and smart sensing technologies, announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.

Part of the DARPA Toolbox initiative, the partnership will aim to establishe an access framework under which DARPA organizations can access all of CEVA's commercially available IPs, tools, and support to expedite their programs.

According to DARPA. the DARPA Toolbox is a new, agency-wide effort aimed at providing open licensing opportunities with commercial technology vendors to the researchers behind DARPA programs. The agency claims that, through DARPA Toolbox, successful proposers will receive greater access to commercial vendors' technologies and tools via access frameworks and simplified legal terms.

CEVA, along with Arm and Verific, are the first wave of technology companies to sign commercial partnership agreements under DARPA Toolbox. Key technologies offered by CEVA under the initiative include DSPs and software for 5G baseband processing, short range connectivity, sensor fusion, computer vision, sound processing, and artificial intelligence. 

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U.S. Defense Advanced Research Projects Agency (DARPA)

675 North Randolph Street
Arlington, VA 22203-2114
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