Military Embedded Systems

DARPA officials to present keynote addresses at IMS 2024


May 20, 2024

Lisa Daigle

Assistant Managing Editor

Military Embedded Systems

DARPA officials to present keynote addresses at IMS 2024
Image: Pexels

WASHINGTON, D.C. -- 2024 IEEE MTT-S International Microwave Symposium (IMS). Several of the technical sessions at the IMS 2024 conference -- set to be held June 16-21, 2024 -- will feature keynote speakers from the U.S. Defense Advanced Research Projects Agency (DARPA), a research and development agency of the U.S. Department of Defense (DoD) responsible for the development of emerging technologies for use by the military.

DARPA Program Manager Paul Jaffe will give a keynote address at one of Tuesday's technical sessions on "POWER: Persistent Optical Wireless Energy Relay, and DARPA's Pathway to Energy Web Dominance." According to IMS preshow information, Jaffe's address will posit how POWER [Persistent Optical Wireless Energy Relay], which intends to leverage power beaming, will help the U.S. build a new and more resilient energy-distsribution network and enable robust connections between secure energy souces and places of high energy need.

DARPA colleague Dev Palmer will deliver another address on Tuesday, this one called "Advancing Performance in 3DHI" or three-dimensional heterogeneous integration. The concept of 3DHI is expected to drive the next major wave of innovation in microelectronics: It is expected to enable the integration of heterogeneous materials, devices, and circuits through advanced packaging, which produces a tightly coupled system that extends into the third dimension and performs at far higher levels than that available using today's monolithic approach. DARPA's Next-Generaion MIcroelectronics Manufacturing (NGMM) program is expected to kick off in summer of 2024, is intended to address known barriers to 3DHI research and development and cycle time.

Another DARPA address on the subject of 3DHI will be delivered at IMS by Thomas Kazior, Program Manager, DARPA Microsystems Technology Office. Kazior's keynote address will present an overview of programs that are developing silicon-based analogs that will enable 3D heterogeneous integration of high-performance compound semiconductor transmit and receive amplifiers having silicon and nonsilicon components to create efficient millimeter-wave arrays. These programs, Kazior asserts, are paving the way for next-generation millimeter arrays and massive MIMO data transfer systems. 

For additional information, visit the IMS 2024 website at

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