Product of the Week: Omnetics Nano-D/Bi-Lobe Single Row Horizontal SMT (AA)

This week’s product, the Omnetics Nano-D/Bi-Lobe Single Row Horizontal SMT (AA) connectors, meet MIL-STD 32139 and are designed for the stringent size, weight, and power (SWaP) requirements needed for military and space applications. The devices are suited for applications calling for extreme signal integrity and harsh-environment specifications such as radar, weapons systems, communications gear, satellites, instrumentation, avionics, and more.

The Nano-D/Bi-Lobe connectors offer an extremely low-profile package that is well-suited for pick-and-place mounting methods. They also have a very tight pitch of .025″ (.64 mm) centerlines.

Featuring Omnetics highly reliable gold-plated Flex Pin contact system, the connectors conform to the requirements of MIL-DTL-32139. Available with threaded mounting holes suitable for PCB and flex mounting, the Omnetics components are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations.

Miniaturization demand

Improvements in chip technology have impacted circuit board designs as well as connector and cable interconnections, demanding greater miniaturization at lower voltages and current levels. The family of Nano-D connectors meets this need, as each connector is designed to perform at military specification levels for high-reliability and extreme environments. Most Nano-D connectors evolved from the older Micro-D and follow the similar specifications.

Electrical mechanical specifications

Temperature: -55 °C to +125 °C (200 °C w/HTE)
Dielectric withstand voltage: 250 VAC RMS Sea Level
Contact resistance: 71 mV Drop @ 1 AMP
Current rating: 1 AMP per contact
Durability: 200 mating cycles minimum
Insulation resistance: 5000 megohms min @ 100 VDC
Shock: 100 gs with no discontinuities > 10 nanoseconds
Vibration: 20 gs with no discontinuities > 10 nanoseconds
Thermal vacuum outgassing: 1.0% max TML, 0.1% max VCM
Mating/Unmating force: 7 oz. (198 g) max per contact

Material specifications

Shell material and finish: aluminum shell, electroless nickel plated aluminum shell, black anodized aluminum shell, cadmium plated titanium shell, unplated stainless steel shell, passivated
Insulator: liquid crystal polymer per MIL-DTL-32139 or PEEK
Pin: gold-plated BeCu [highly conductive copper beryllium]
Socket: gold-plated copper alloy
Encapsulant: epoxy

For more information, visit the Nano-D Bi-Lobe page here, or visit the company’s website, or follow the links below.

Resources:

To download the Nano-D/Bi-Lobe datasheet, click here.
To download the Nano-D/Bi-Lobe Single Row Horizontal SMT (AA) Ordering Guide, click here.
To learn about Omnetics military & defense business, click here.
To learn about all Omnetics connector products click here, click here.
For sales information, click here.