Military Embedded Systems

Defense Dept. awards IBM a spot on project to develop trusted, resilient microelectronics for U.S. defense use


December 23, 2020

Lisa Daigle

Assistant Managing Editor

Military Embedded Systems

(Stock photo.)

ARMONK, N.Y. IBM has entered into a Phase 1 Other Transactions Agreement with Naval Surface Warfare Center (NSWC) Crane Division within the U.S. Department of Defense (DoD) to support advancing U.S. microelectronics technology.

The pact -- part of the Rapid Assured Microelectronics Prototypes (RAMP) Advanced Commercial Capabilities Project through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) -- is aimed at leveraging commercial industry's expertise and demonstrating measurably secure physical design of state-of-the art microelectronics technologies, application-specific integrated circuits (ASICs), and systems-on-chip (SoCs).

For the next several months, IBM authorities say that the company's research and services teams, along with some of its partners, will investigate an integrated approach to help identify and mitigate threats to secure, resilient microchip technology manufacture and use, with the end result meant to enable manufacture of measurably secure microelectronics with lower power consumption, improved performance, reduced physical size, and enhanced reliability. 

Jay Bellissimo, IBM's general manager, U.S. Public and Federal Market, said of the project: "The semiconductor industry is critical for our nation's security, technology leadership, and economic growth. IBM is proud to be one of DoD's suppliers in this critically important mission and put our cutting-edge technologies and expertise in service of the defense community."

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