San Diego, CA 92121 [email protected]
New congatec modules with 11th Gen Intel Core processors for outdoor and in-vehicle applications - Press ReleaseNovember 13, 2020
San Diego, CA, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.
San Diego, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake). The new COM-HPC standard impresses with a broad range of latest high-speed interfaces such as PCIe Gen 4 and USB4, a future proof high-speed connector, and a comprehensive feature set for remote management. The latter, in particular, is of utmost importance for all the emerging broadband connected edge applications, which range from dedicated edge devices to rugged edge clouds and real-time fogs.
San Diego, CA, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – significantly broadens the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with up to 2x generational uplift in performance per watt , a 2x more CPU cores compared to previous generations, at only 76% of the previous size on a 100% pin-compatible form factor.
San Diego, CA, 23 September 2020 * * * congatec – a leading vendor of embedded and edge computing technologies – announces launch of 12 brand new Computer-on-Modules in parallel with today’s Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors.
San Diego, CA, 16 July 2020 * * * congatec - a leading vendor of embedded computing technology - extends its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimized for price sensitive markets.