Military Embedded Systems

High-density, secure memory device in production with Mercury Systems

News

June 24, 2020

Emma Helfrich

Associate Editor

Military Embedded Systems

High-density, secure memory device in production with Mercury Systems

ANDOVER, Mass. Mercury Systems, Inc., company specializing in mission-critical technologies for aerospace and defense, announced volume production of its newest, high-density (HD) secure memory device, with the most capacity in the smallest form factor available, according to the company.

Mercury intends to take data-intensive processing applications to the edge by embedding 4GB of double data rate third-generation (DDR3) synchronous dynamic random-access memory (SDRAM) in a compact, ruggedized package for optimal data center-grade performance in harsh environments.

Avionics, mission computing, and sensor processing subsystems are tasked with analyzing multiple streams of data simultaneously, requiring increasing amounts of system memory. Storing large volumes of memory often requires a circuit board consisting of several smaller memory blocks which are difficult to fit into size-constrained applications.

According to the company, with Mercury’s space-saving DDR3 device, multiple blocks of memory are designed to be consolidated into a single device smaller than a quarter, providing a 59% space savings compared to traditional 4GB DDR3 memory. By using this smaller form factor device, system architects can take full advantage of the latest edge-processing modules, intended to bring AI-level functionality to contested environments.

 

Featured Companies

Mercury Systems

50 Minuteman Road
Andover, Massachusetts 01810
https://www.mrcy.com/