Season's Greetings from Acromag! Here?s a Quick Recap of 2018.
Eletter Product
This year many new boards are offered to help you with all of your rugged I/O applications.
Next year has great things happening too!
Watch for new XMC 10GbE modules, VPX 6U processor boards, and AcroPack mPCIe carriers for VPX, PCIe, CompactPCI Serial and COM Express Type 10 SFF Embedded computers.
Scroll to see what you might have missed.
New MIL-STD-1553 Communication Modules on a on a Ruggedized Mini-PCIe Form Factor
AcroPack® communication modules target avionics databus applications with a high-performance design in a tiny footprint.
Multi-function I/O XMC Mezzanine Modules Feature A/D, D/A, and Digital I/O Channels to Conserve I/O Slots Provides Full Multi-function Databus Communication
The new XMC730 provides flexible, high-density I/O with high-performance DMA to solve a variety of SWaP-challenges.
New Quad-port Gigabit Ethernet XMC Modules Available in RJ45, SFP, and Rear I/O Versions to Meet a Variety of Application Requirements
Three new 1GbE Network Interface Card (NIC) mezzanine modules provide a flexible, high-density solution for Ethernet communication over fiber or copper media.
New CAN Bus Interface Module Features Four Isolated Channels on a Ruggedized Mini-PCIe Form Factor
AcroPack® CAN bus modules target defense and avionics applications with high-density PCIe mezzanine supporting ARINC 825 and CANaerospace standards.
New High-Speed D/A Converter Voltage Waveform Output Mezzanine Board
AcroPack® PCIe Bus Interface boards drive up to 16 devices with continuous waveforms output from onboard memory without host intervention.
For more information contact Acromag Inside Sales at 877-295-7088 or [email protected].
