Military Embedded Systems

DoD and Estonian officials sign tech R&D agreement

News

June 24, 2016

Mariana Iriarte

Technology Editor

Military Embedded Systems

DoD and Estonian officials sign tech R&D agreement
Photo by DoD/ Sgt. 1st Class Clydell Kinchen

WASHINGTON. U.S. Department of Defense (DoD) and Estonian Ministry of Defense officials signed an agreement reinforcing cooperation between the two parties on technological research and development (R&D), testing, and evaluation activities.

Eerik Marmei, Estonian Ambassador to the United States and Jim Townsend, Deputy Assistant Secretary of Defense for Europe and NATO signed the agreement, which facilitates the collaborative efforts to enhance capabilities including basic and applied research, advanced technology development, advanced component and prototype development, and evolutionary acquisition and spiral development.

The agreement also permits the establishment of working groups and the transfer of equipment and material to improve collaboration and innovation. Estonia is known for its leadership in cybersecurity, e-governance, and innovation. DoD officials say they expect this agreement to lead to beneficial technological advances.