Military Embedded Systems

Strategic Alliance Agreement signed between Rockwell Collins and U.S. Army

News

October 14, 2015

Mariana Iriarte

Technology Editor

Military Embedded Systems

WASHINGTON. Rockwell Collins and the U.S. Army Material Command signed a Strategic Alliance Agreement that focuses on the implementation of strategies and initiatives to optimize efforts to supply advanced products and services to warfighters.

“The shared goal of this agreement is to achieve quicker contracting, by leveraging and expanding existing contract vehicles and increasing the speed of business. This will result in cost savings, increased communications and sharing of technologies, and opening the door to have direct dialogue with the Army,” says Thierry Tosi, vice president and general manager of Service Solutions for Rockwell Collins.

In the agreement under supply and repair activities, where Rockwell Collins is the approved source, the parties agree to work on “smoothing” of commerciality determinations, develop reportable metrics, improved software update distribution and sharing, and optimized lead times.

 

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