Mercury Systems Receives $8.2M Order for SWaP-Optimized Memory for Advanced Airborne C2I ApplicationPress Release
June 20, 2019
ANDOVER, Mass. - June 6, 2019 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced it received an $8.2 million follow-on order from a leading defense prime contractor for rugged, ultra-compact memory devices integrated into an advanced airborne command, control and intelligence application. The order was booked in the Company’s fiscal 2019 fourth quarter and is expected to be shipped over the next several quarters.
The Company’s flagship memory product combines Mercury’s best-in-class technology with the latest commercial memory devices to solve the customer’s most critical requirements for high-speed data processing. 16 GB of double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) is embedded into a 16mm x 23mm ball grid array, enabling the customer to save up to 83% printed circuit board space for SWaP-constrained military applications. Using highly automated manufacturing processes, Mercury’s innovative miniaturization technology transforms a two-dimensional array of discrete memory devices into a single, trusted, military-hardened three-dimensional device delivering data transfer rates as high as 2,666 megabits per second (Mbps). Mercury’s entire portfolio of memory devices is designed and manufactured exclusively in its five Advanced Microelectronics Centers (AMC) located throughout the U.S., assuring customers an affordable domestic supply of trusted microelectronics for critical military programs.
“We are honored to support our valued customer with state-of-the-art trusted memory devices for applications facing severe physical space constraints,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our military forces can rest assured that Mercury’s innovative packaging technology ruggedizes the most advanced commercial memory in the smallest possible form factor, thereby freeing valuable circuit board space for additional sensor processing subsystems.”