Diamond Systems Corporation
Articles related to Diamond Systems Corporation
September 10, 2013
Embedded computing in the military is trending toward wearable, handheld, and other small and lightweight systems, as well as experiencing increased downward pressure on cost. These systems require rethinking the internals in order to achieve their goals of size, weight, and cost. As a result, the traditional architectures of card cages and stackable systems, which are ideal for quick time to market but carry additional bulk and cost, are giving way to the lighter and more efficient COTS-based COM + baseboard approach. In addition to benefits in size and weight, COM + baseboard systems offer significantly longer lifetimes, fewer problems during technology refresh cycles, and equivalent ruggedness and reliability, making them ideal for long-lasting military programs.
Magellan PCI-104 SBC with choice of COM Express CPUs and PCI-104, SUMIT or FeaturePak I/O Expansion - Eletter ProductJune 27, 2012
Magellan is a high performance, highly integrated single board computer that matches the footprint of the popular COM Express computer-on-module standard. Magellan's CPU core consists of a COM Express module with either a 1.1GHz Intel Atom Z510 or 1.6GHz Core2 Duo CPU.
Conduction Cooled Single Board Computer in EMX Basic Form Factor features Intel Atom E680T CPU - Eletter ProductApril 09, 2012
Diamond Systems newest single board computer, Altair, is a rugged EMX Basic single board computer (SBC) based on the Intel Atom E680T CPU running at 1.6GHz, featuring dual Gigabit Ethernet ports, 4 serial ports, and 4 USB 2.0 ports. Altair is also the first SBC to implement the new EmbeddedXpress? (EMX) stackable I/O standard, the next step in I/O connectivity for small form factor embedded computing.
April 29, 2011
A recent military contract called for a compact, rugged, wide-temperature embedded system to be used in upgrading the U.S. Marine Corps already-vehicle-deployed Onboard Computers (OBCs). The challenge of upgrading the OBCs was met by integrating two CPU subsystems within a single PC/104 stack, while utilizing a new approach to conduction cooling.