Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
Graphic: Lynx
Product
Lynx offers LYNX MOSA.ic.AI deployment platform for mission-critical environments

April 08, 2026

More Avionics
Unmanned
Image via Abaco Systems
News
FPGA processing card to increase data processing speeds released by Abaco Systems

April 08, 2026

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A.I.
Image via Qinetiq
News
Mission data center to be established in Belgium by QinetiQ

April 02, 2026

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Comms
Image via General Dynamics
News
Advanced reconnaissance vehicles from General Dynamics to enter next phase for U.S. Marine Corps

April 08, 2026

More Comms