Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
Image via BAE Systems
News
E-2D identification friend or foe service depot to be established for U.S. Navy by BAE Systems

January 15, 2026

More Avionics
Unmanned
Whitepaper
A Practical Guide to Deploying Rugged Computing Solutions in Harsh Environments

January 16, 2026

More Unmanned
Radar/EW
Image via SSDL
News
FLOPPYFlash drive to replace old decoy launcher hardware on UK Royal Navy ships

January 07, 2026

More Radar/EW
A.I.
Image: Abaco Systems
News
SOSA aligned SBC with advanced AI capabilities introduced by Abaco Systems

January 15, 2026

More A.I.