Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
GCAP concept via Rolls-Royce
News
Combat aircraft engine demonstrator moves toward ground testing

July 20, 2026

More Avionics
Unmanned
MORFIUS concept via Lockheed Martin
News
Airborne microwave counter-drone system enters prototype production

July 20, 2026

More Unmanned
Radar/EW
MSSR-1 radar via CSG
News
Air traffic surveillance radars approved for delivery to Vietnam

July 17, 2026

More Radar/EW
A.I.
F-16 modified with VENOM via U.S. Air Force
News
AI-controlled F-16 begins autonomous flight testing for DARPA

July 17, 2026

More A.I.