Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
U.S. Army Reserve photo of a Chinook by Spc. Bryson Ruggs
News
Avionics upgrades to support U.S. Army Chinook helicopters under $472 million contract

August 11, 2026

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Unmanned
Vehicle-mounted SGT STOUT via Leonardo DRS
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Counter-UAS software upgrade demonstrated on U.S. Army air-defense system

August 12, 2026

More Unmanned
Radar/EW
BAE Systems graphic
News
RF heat-removal project for DARPA takes BAE Systems to Phase 2

August 12, 2026

More Radar/EW
Comms
Concept image via Northrop Grumman
News
Space-based cryptographic systems to be developed by Northrop Grumman, Aeronix

August 13, 2026

More Comms