Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
Image via Airbus
News
First H145M light combat helicopter delivered to German Armed Forces

November 19, 2024

More Avionics
Radar/EW
Image via BAE Systems
News
EW countermeasures to be developed for U.S. Army combat vehicles by BAE Systems

November 20, 2024

More Radar/EW
A.I.
Sponsored Story
PRODUCT OF THE WEEK: VersaLogic’s Sabertooth AI embedded computer

October 28, 2024

More A.I.
Cyber
Graphic courtesy RTX
News
Cyber hardening program from DARPA gets RTX BBN Technologies on board

November 07, 2024

More Cyber