Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
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Radar SiP contract announced by Mercury

June 26, 2020

Avionics
U.S. Air Force photo courtesy of Northrop Grumman
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YFQ-48A designation assigned to Project Talon semi-autonomous prototype aircraft

December 23, 2025

More Avionics
Radar/EW
Mounted APNT image: Collins Aerospace
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Small-form-factor A-PNT demoed during Army experiment

December 22, 2025

More Radar/EW
A.I.
Vicor factorized power architecture illustration: Spacechips
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AI accelerator card under development for in-orbit applications

December 12, 2025

More A.I.
Cyber
Graphic courtesy Corsha
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Air Force installation to begin M2M comms across systems, infrastructure

December 02, 2025

More Cyber