Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
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Radar SiP contract announced by Mercury

June 26, 2020

Unmanned
Image via Aerovironment
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GAO upholds $990 million Switchblade systems contract award

December 18, 2024

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Radar/EW
Image via Kongsberg
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NASAMS air defense systems to be provided to Norway by Kongsberg

December 20, 2024

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A.I.
Image via Lufthansa Technik
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Lufthansa Technik, Microsoft to partner on AI in aircraft maintenance

December 16, 2024

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Cyber
Graphic courtesy Akima
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IT services contract with Akima signed by U.S. Indo-Pacific command

December 10, 2024

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