Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
Image via Leonardo
News
C-27J maritime patrol aircraft to be supplied to Saudi Arabia by Leonardo

February 17, 2026

More Avionics
Unmanned
Image via Analog Devices
News
All-in-one X-band front-end integrated circuit introduced by Analog Devices

February 17, 2026

More Unmanned
Radar/EW
Press Release
Senseeker Machining Company Acquires Axis Machine

February 11, 2026

More Radar/EW
A.I.
U.S. Air Force artwork courtesy of General Atomics Aeronautical Systems, Inc. and Anduril Industries
News
Mission autonomy software from Shield AI to support U.S. Air Force Collaborative Combat Aircraft program

February 13, 2026

More A.I.