Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Avionics
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C-130 sustainment services approved for Vietnam

June 03, 2026

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Radar/EW
Sponsored Story
PRODUCT OF THE WEEK: Wolf VPX3U-AD5000E-CX7 HPEC module

June 08, 2026

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A.I.
Image courtesy Kontron
News
AI-enabled, SOSA aligned 3U VPX board launched by Kontron

May 28, 2026

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Comms
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Battlefield communications module to be unveiled by Vegvisir at Eurosatory 2026

June 05, 2026

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