Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
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Radar SiP contract announced by Mercury

June 26, 2020

Avionics
Image via Hypersonix
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Scramjet-powered hypersonic aircraft to launch from Virginia

February 25, 2026

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A.I.
U.S. Air Force artwork courtesy of General Atomics Aeronautical Systems, Inc. and Anduril Industries
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Mission autonomy software from Shield AI to support U.S. Air Force Collaborative Combat Aircraft program

February 13, 2026

More A.I.
Cyber
Wraithwatch image
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Cyberdefense company to leverage AI tools for U.S. federal agencies

February 23, 2026

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Comms
Image via Orbit
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Satellite communication systems to be supplied to Israel by Orbit

February 27, 2026

More Comms