Kontron's Zack McGrath, product portfolio manager, talks with Tom Varcie of Military Embedded Systems and gives all the details.

The United States Congress wants to see the Department of Defense’s (DoD’s) plans to upgrade to wireless communication on military bases – a step toward getting all personnel and Pentagon-owned assets on advanced networks tailored to their military-security needs. The move is another piece of the strategy of leveraging the advanced wireless technologies of commercial telecommunications while enabling extensions that will fit mission needs around the world. These innovations are yet another connectivity advancement that will ultimately support making the Combined Joint All-Domain Command and Control (CJADC2) initiative a reality.

WASHINGTON. The U.S. Department of Defense (DoD) and U.S. Department of Commerce announced that Intel Corp. has received as much as $3 billion in direct funding under the CHIPS and Science Act as part of the Secure Enclave program, which was started to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

OWEGO, N.Y. Lockheed Martin, Intel Corp., and Altera, an Intel Company, are joining hands to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E). Lockheed Martin will develop a low size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA) aligned airborne electronic defense system, leveraging the Altera Multi-Chip Package (MCP2) for expected use on the U.S. Navy’s MH-60R multi-mission helicopter. 

Intel official announced that the company is spinning off their nProgram Solutions Group (PSG) as a standalone company, named Altera, the group’s original name when first acquired by intel in 2015. Altera’s field programmable gate array (FPGA) devices are key components in military sensor and signal procession applications like radar, electronic warfare, signals intelligence, and others.

ARLINGTON, Va. and SANTA CLARA, Calif. Boeing and Intel announced a new strategic collaboration under which the companies are working together to advance semiconductor technology across the aerospace industry, with the intent to create next-generation microelectronics applications in artificial intelligence (AI), secure computing, and advanced flight capabilities for future products.

This week’s product, the Kontron VX3060-S2 3U VPX Rugged Blade PC, leverages the 11th Gen Intel Core processor for artificial intelligence (AI), CVGIP, and digital signal processing (DSP) workloads. Developed in alignment with the Sensor Open Systems Architecture (SOSA) Technical Standard, the VX3060-S2 serves demanding military programs with intensive processing and extreme ruggedization requirements.