TEWS Technologies
VITA Standards Organization and ANSI formally ratify ANSI/VITA 93.0-2025 QMC - News
September 30, 2025PINNEBERG, Germany and RENO, Nevada. TEWS Technologies is pleased to announce that the VITA Standards Organization and ANSI have formally ratified ANSI/VITA 93.0-2025 QMC, marking a key milestone in the evolution of modular I/O and mezzanine architecture for embedded systems.
INDUSTRY PERSPECTIVE: VITA 93 QMC -- A modular leap forward for embedded defense systems - Story
September 03, 2025The defense landscape is evolving rapidly – nowhere more visibly than in the skies over Ukraine. There, small, cost-effective drones have become indispensable tools for surveillance, targeting, and tactical disruption. This shift underscores a broader reality: embedded systems must now be smaller, more modular, and rapidly adaptable to new mission requirements. Platforms must be smaller, more modular, and rapidly upgradable. One powerful response to these demands is the emergence of the VITA 93 QMC standard that brings unprecedented modularity, flexibility, scalability, and ruggedness to system designers, making it highly relevant to modern defense and aerospace applications.
TEWS Technologies introduces first QMC Modules and PCIe Carrier Compliant with new VITA 93 – QMC Standard - Press Release
June 25, 2025PINNEBERG, Germany. TEWS Technologies, a global leader in embedded I/O solutions for demanding defense and industrial applications, is pleased to announce the release of a comprehensive new portfolio of QMC modules and the TPCE210 dual-site carrier card, fully compliant with the emerging VITA 93 – QMC Mezzanine Card standard.
VITA 93 - QMC - Advancing Embedded Systems with VITA 93 (QMC): A New Era in Modular IO Solutions - Whitepaper
January 13, 2025VITA 93 (QMC) represents a groundbreaking advancement in mezzanine card technology, offering unmatched modularity, flexibility, scalability, and reliability. With its well-thoughtout cooling concept, universal compatibility, and robust design, it sets a new standard for embedded systems across industries.
White Paper Detailing Revolutionary VITA 93 Standard’s Modularity, Flexibility, Scalability, and Thermal Advantages Released by TEWS Technologies - Press Release
January 13, 2025New white paper explores how QMC technology addresses critical SWaP challenges in embedded computing
PINNEBERG, Germany, January 2025 -- The VITA 93 (QMC) standard is transforming embedded computing design in defense, industrial, and transportation applications. A new white paper authored by experts at TEWS Technologies provides system architects and design engineers with crucial insights into how the mezzanine standard addresses modern bandwidth, size, and flexibility requirements.
TEWS Technologies Adds Higher Performance Advanced FPGA to Enhance Existing Range of Digital and Analog XMC Modules - Product
February 12, 2024PINNEBERG, Germany. TEWS Technologies has lanched its latest product: TXMC639 - Reconfigurable FPGA with 16x Analog Input 8x Analog Output and 32x Digital I/O.
TEWS Technologies Launches TXMC897 Switched Mezzanine Card for Enhanced Ethernet Connectivity - Press Release
January 10, 2024PINNEBERG, Germany. January 10, 2024 – TEWS Technologies, renowned for its expertise in designing and building turnkey, embedded interface solutions, launched its latest product, the TXMC897 Switched Mezzanine Card (XMC)-compatible module.






