PINNEBERG, Germany. TEWS Technologies introduced the TVPX210, what it calls the industry’s first dedicated VPX carrier for VITA 93 QMC modules. 

PINNEBERG, Germany. TEWS Technologies GmbH announced the release of its TVNX210, a VNX+ carrier board intended for use with QMC modules. 

PINNEBERG, Germany. TEWS Technologies announced an expansion of its embedded VITA 93-QMC product portfolio as it introduced eight new single-width QMC modules and a CompactPCI Serial QMC carrier, all of which the company says enable users to realize greater flexibility, simplified integration, and improved scalability for demanding embedded computing applications. 

PINNEBERG, Germany and RENO, Nevada. TEWS Technologies is pleased to announce that the VITA Standards Organization and ANSI have formally ratified ANSI/VITA 93.0-2025 QMC, marking a key milestone in the evolution of modular I/O and mezzanine architecture for embedded systems.

The defense landscape is evolving rapidly – nowhere more visibly than in the skies over Ukraine. There, small, cost-effective drones have become indispensable tools for surveillance, targeting, and tactical disruption. This shift underscores a broader reality: embedded systems must now be smaller, more modular, and rapidly adaptable to new mission requirements. Platforms must be smaller, more modular, and rapidly upgradable. One powerful response to these demands is the emergence of the VITA 93 QMC standard that brings unprecedented modularity, flexibility, scalability, and ruggedness to system designers, making it highly relevant to modern defense and aerospace applications.

PINNEBERG, Germany. TEWS Technologies, a global leader in embedded I/O solutions for demanding defense and industrial applications, is pleased to announce the release of a comprehensive new portfolio of QMC modules and the TPCE210 dual-site carrier card, fully compliant with the emerging VITA 93 – QMC Mezzanine Card standard.

VITA 93 (QMC) represents a groundbreaking advancement in mezzanine card technology, offering unmatched modularity, flexibility, scalability, and reliability. With its well-thoughtout cooling concept, universal compatibility, and robust design, it sets a new standard for embedded systems across industries.