As increasing numbers of embedded systems are deployed on small platforms, thermal overdesign – or designing for a physically impossible worst case of simultaneous maximums – is becoming a significant issue. It can be addressed, without compromising system viability, by using a real-world focus to define combinations of thermal triple-threat specifications. Engineers can then use software simulations for each combination of specs in an iterative fashion, modifying design parameters until acceptable thermal performance is achieved for all combinations.

AUSA 2021--WASHINGTON. Military Embedded Systems is excited to announce today the winners of our Best in Show Award contest, which which we're holding for our supporters exhibiting at the Association of the U.S. Army (AUSA) Annual Meeting, held last week, Oct. 11-13 in Washington, D.C. Contest winners -- drawn from military embedded systems exhibitors at the event -- are recognized for the improved performance and innovation they bring to military electronic systems applications such as radar, electronic warfare, and avionics as well as for rugged computing, interconnect technology, artificial intelligence (AI), and embedded computing.

BROCKTON, Mass. Atrenne, A Celestica Company, announced the launch of a new series of Gen-4/5 OpenVPX backplanes. This series is part of Atrenne’s product family that is intended to enable end-to-end solutions for 64/100 Gigabit systems.