Military Embedded Systems
Topic: FPGA

Improving RF adaptability for radio frequency system-in-packages
February 12, 2025
Mixed-signal devices have seen an increase in popularity as design techniques and process technologies continue to advance. However, end users still find themselves forced to make difficult trade-offs between bandwidth, dynamic range, and power and then must be committed to their decisions for the lifetime of the device. Next-generation modular RFSiP [radio frequency system-in-package] designs will introduce a new degree of freedom to address diverse signal-processing applications.
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Radar/EW
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AI communications intelligence device unveiled by Babcock at DSEI
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AI-enabled rugged smart displays debut from Leonardo DRS
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Digital C2 software to equip German Army dismounted forces
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Spectrum Dominance e-Book
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CACI to provide Pacific network modernization to U.S. Air Force
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Savox Communications and Nokia announce agreement to explore joint development of tactical communications solutions
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